| 1 Product layers |
Single, double, multi
layer (maximum layers：16) |
| 2 Chips material |
FR-4、CEM-1、CEM-3、HF board material |
| 3 Finished board size |
Maximum size of single, double board/㎜ 610×450 |
| Maximum size of multi
layer board/㎜
500×450 |
| Thickness（Rigidity）/㎜
0.3～3.2 |
| 4 Production capacity |
Double-faced board
(㎡) 120，000 |
| Multi layer (㎡) 80，000 |
| 5 the smallest metal
aperture/㎜ |
0.2 |
| 7 Wire width and wire spacing |
Minimum wire width /㎜
0.1 |
| Minimum wire spacing /㎜
0.1 |
| 8 Provided solder type |
Ray solder or liquid sensitization solder |
| 9 Printed words |
Language ink colors: White, black |
|
The smallest character line diameter/㎜
0.1 |
| 10 Thickness of lead plating |
Hole wall thickness of plating copper/um |
Normal
25.4 |
|
Minimal
15 |
|
Maximal
50 |
|
Thickness of soldering tin (热风不息平板)/um |
Minimal
2 |
|
Maximal
30 |
|
Thickness of lead-tin
(红外热熔前)/um |
Minimal
5 |
|
Maximal
12 |
|
Thickness of nickel/um |
Minimal
3 |
|
Maximal
5 |
|
Thickness of Pin Nickel
and plating gold /um |
Nickel layer |
Minimal 3 |
|
Maximal 5 |
|
Gold layer |
Minimal 0.05 |
|
Maximal 1.0 |
| 11 Testing method of optical board |
Single (normal)/double、multi layer (special)
testing |
| Maximal testable points
12,228/4,096 |
| Maximal testable size/
mm 230×320/450×350 |
| 12 Especial machine process |
Pin angle
30° 45° 60° |
| V groove、U groove |
| 13 Shape process difference/mm |
Size≤100
±0.10 |
|
Size＞100
±0.30 |
| 14 Insulated resistance
/∩ |
1×10〞 (Normal) |
| 15 Electricity intensity
1.2kV/mm (Normal) |
≥1.2 |
